Prof. David Atienza, head of the Embedded Systems Lab (ESL) has just completed a twenty-year survey of power and thermal modelling and management, with the help of his ESL team members, which was published in IEEE Design & Test this month.
The survey was performed in collaboration with Guest Prof. Luis Costero, Dr. Darong Huang and PhD candidate Kai Zhu. As well as providing a detailed history of the technology, which has seen a lot of changes in the last twenty years, the authors were able to make predictions about future trends and challenges.
In parallel, the same team of researchers have released 3D-ICE version 4.0, a new thermal modelling emulator with more capabilities than have been seen thus far.